For applications requiring an LMP (Low Melting Point) solder, this Tin Bismuth alloy ticks the boxes.
- Covenient sized pellets for solder pots
- Melting point of 138°C
- An ideal size for solder pot top up
Alloy: Tin 42% Bismuth 58%
Melting Point: 138°C
Recommended solder pot temperature: 170 - 180°C
Standard: Manufactured to EN ISO 9453:2006 Soft Solder Alloys
Standard Delivery
Usual shipping within 2-5 daysNext Day
Service available. Cut-off by 12.30pmCollect in Store
Click & CollectSome applications require joint formation by soldering at a low temperature. This 42% Tin and 58% Bismuth gives the added benefit of a melting point of 138°C while also producing a strong solder joint. Generally sold in pot sizes of 1kg for covenient solder bath filling. For large quantities please contact us for our best price.
Prices shown are per kg
Convenient pellet size for all solder pots
Supplied in a handy tub
Competitive pricing and quick delivery