A solid core solder wire manufactured from a Tin Bismuth low melting point alloy and in a thin 1.2mm thickness. Supplied as a 500g per box.
- USE: Printed Circuit Board Assembly (temperature-sensitive component soldering)
- ALLOY: Tin 42% Bismuth 58%
- MELTING TEMPERATURE: 138°C eutectic
- FLUX: Solid Core
- GAUGE: 1.2mm (18SWG)
- RoHS COMPLIANT: YES
- NO CLEAN: YES
- REEL SIZE: 500g
Standard Delivery
Usual shipping within 2-5 daysNext Day
Service available. Cut-off by 12.30pmTin Bismuth solder wire, with a melting point of 138°C, is ideal for soldering of temperature-sensitive components. Supplied as a solid core (no inner flux core) lead-free solder wire, this solder gives good wetting and solder flow. Tin Bismuth solder can be used for additional work on PCB's soldered with a SAC alloy. Packaged as a 500g box this solder wire we recommend using with the PF670 flux gel to promote increased rapid wetting.
Low-temperature eutectic Tin Bismuth alloy
Prevents thermal damage to heat-sensitive devices
Not recommended for handheld devices due to Tin Bismuth brittle element (Products that can be subject to drop-shock)