Tin Bismuth solder paste alloy for heat-sensitive electronic components and low-temperature soldering. Available in cartridges and jars for prototype and production of Surface Mount Technology (SMT) work.
- A eutectic Sn42 Bi58 alloy
- A type 3 (25-45um) solder powder
- The 670 is a no-clean solder paste flux
- Melting Point: 138°C with peak reflow temperature: 160°C - 175°C
- Bellcore Compliant
- Tack Time: 4 - 8 hours
- Is processable by infrared reflow, forced convection or vapour phase
- Flux classification: REL0
Standard Delivery
Usual shipping within 2-5 daysThe Qualitek 670 tin bismuth solder paste has been developed for low-temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C, the 670 tin bismuth paste is suitable for soldering temperature-sensitive surface mount components. The 670 is a no-clean solder paste.
A eutectic Sn42 Bi58 solder alloy with a low melting point
Non-corrosive clear residues
Available as a type 3 (25-45um) particle size
Available in syringes and jars