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Tin Bismuth Low Temperature Solder Paste

From £45.00 £37.50
Please Allow 3 - 4 days for Dispatch
Only %1 left
SKU
Q670-SN42BI58
MPN: Qualitek Delta 670
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Tin Bismuth solder paste alloy for heat-sensitive electronic components and low-temperature soldering. Available in cartridges and jars for prototype and production of Surface Mount Technology (SMT) work.

  • A eutectic Sn42 Bi58 alloy
  • A type 3 (25-45um) solder powder
  • The 670 is a no-clean solder paste flux
  • Melting Point: 138°C with peak reflow temperature: 160°C - 175°C
  • Bellcore Compliant
  • Tack Time: 4 - 8 hours
  • Is processable by infrared reflow, forced convection or vapour phase
  • Flux classification: REL0

TECHNICAL DATASHEET FOR QUALITEK TIN BISMUTH SOLDER PASTE

SAFETY DATASHEET FOR QUALITEK 670 SOLDER PASTE

Standard Delivery

Usual shipping within 2-5 days

The Qualitek 670 tin bismuth solder paste has been developed for low-temperature soldering. With a melting point of 138°C and a peak reflow temperature of approximately 173°C, the 670 tin bismuth paste is suitable for soldering temperature-sensitive surface mount components. The 670 is a no-clean solder paste.

A eutectic Sn42 Bi58 solder alloy with a low melting point

N
on-corrosive clear residues

Available as a type 3 (25-45um) particle size

Available in syringes and jars

 
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